EDI’s laser drilling service provides high speed, high accuracy drilling of small holes in a wide array of materials. This process produces thru-holes by repeatedly pulsing focused laser energy onto a surface. Trepanning is used where larger holes are required, meaning that the laser is moved around the circumference of the hole until the desired diameter is achieved. The no contact process offers distinct advantages over EDM and mechanical drilling especially when working with glass, ceramic, PCBs and semiconductor materials like:
- Silicon
- Silicon Carbide
Advantages of Laser Drilling
- Less heat into the material
- Less stress and therefore less cracking
- No tooling breakdown
- Very small repeatable holes with precise taper each time
- Drilling on hard, soft and difficult to process materials
- Eliminates the need for secondary operations like burr removal
- Increased yields
