Laser ablation is an incredibly fast process used to precisely remove layers of material and unwanted depositions on substrates or circuit boards. Generally, we are correcting excess material deposition in effort to avoid defective product or in the case of circut boards the process is used to create solder dams.
Laser Ablaton Benefits:
- Removes excess conductive inks and metals without damaging substrate
- Eliminates the need for masking and chemical etching-saving time and money
- Increases throughput with high speed clean up, reduces scrap
